Baiyun SLF385 Silicone Encapsulant
Potting Sealant for Electronic Components and Circuit Boards
- Low viscosity, good fluidity, fast foaming.
- Excellent thermal conductivity and insulation properties.
- Room temperature curing, heating can speed up the curing speed, no corrosion to the substrate.
- Comply with EU RoHS Directive and passed UL certification.
- Two-component silicone sealant, mix ratio (weight or volume) = 1:1
