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Baiyun SLF385 Silicone Encapsulant

Baiyun SLF385 Silicone Encapsulant

Potting Sealant for Electronic Components and Circuit Boards

    • Low viscosity, good fluidity, fast foaming.
    • Excellent thermal conductivity and insulation properties.
    • Room temperature curing, heating can speed up the curing speed, no corrosion to the substrate.
    • Comply with EU RoHS Directive and passed UL certification.
    • Two-component silicone sealant, mix ratio (weight or volume) = 1:1